III-V/Siハイブリッド部分直接接合における非破壊接合状況確認法の提案

Publication Information

Title

Japanese:	III-V/Siハイブリッド部分直接接合における非破壊接合状況確認法の提案
English:	Non-destructive confirmation method of bonding situation for III-V/Si hybrid partial direct bonding

Author

Japanese:	白柳, 菊地健彦, 鈴木純一, 永坂久美, 西山伸彦, 八木英樹, 雨宮智宏, 荒井滋久.
English:	Liu Bai, Takehiko Kikuchi, Junichi Suzuki, Kumi Nagasaka, Nobuhiko Nishiyama, Hideki Yagi, Tomohiro Amemiya, SHIGEHISA ARAI.

Language

Japanese

Journal/Book name

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Volume, Number, Page

Published date

Mar. 2018

Publisher

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Conference name

Japanese:	応用物理学会春季学術講演会
English:	The 65th JSAP Spring Meeting, 2018

Conference site

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