Structure Stability of Electrodeposited Au-Cu Alloy Micro-Cantilever Evaluated By Long-Term Vibration Test for Applications As Movable Components in MEMS Devices

Publication Information

Title

Japanese:
English:	Structure Stability of Electrodeposited Au-Cu Alloy Micro-Cantilever Evaluated By Long-Term Vibration Test for Applications As Movable Components in MEMS Devices

Author

Language

English

Journal/Book name

Japanese:
English:	233rd ECS Meeting

Volume, Number, Page

Published date

May 13, 2018

Publisher

Japanese:
English:

Conference name

Japanese:
English:	233rd ECS Meeting

Conference site

Japanese:
English:	Seattle