Mode I energy release rate measurement for low bending stiffness adherend bonded with a high toughened adhesive

Publication Information

Title

Japanese:
English:	Mode I energy release rate measurement for low bending stiffness adherend bonded with a high toughened adhesive

Author

Japanese:	小松勝男, 関口悠, 佐藤千明.
English:	Katsuo Komatsu, Yu Sekiguchi, Chiaki Sato.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

Published date

Feb. 2018

Publisher

Japanese:
English:

Conference name

Japanese:
English:	6th World Congress on Adhesion and Related Phenomena (WCARP), in conjunction with 41th Annual Meeting of the Adhesion Society

Conference site

Japanese:
English:	San Diego, CA