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Publication Information
Title
Japanese:
English:
Electrodeposition of High Strength Au-Cu Alloys for MEMS Device
Author
Japanese:
Chang Tso-Fu Mark
,
Tang Hao-Chun
,
新田 京太朗
,
陳 君怡
,
名越 貴志
,
山根 大輔
,
小西 敏文
,
町田 克之
,
益 一哉
,
曽根 正人
.
English:
Tso-Fu Mark Chang
,
Hao-chun Tang
,
Kyotaro Nitta
,
Chun-Yi Chen
,
Takashi Nagoshi
,
Daisuke Yamane
,
Toshifumi Konishi
,
Katsuyuki Machida
,
Kazuya Masu
,
Masato Sone
.
Language
English
Journal/Book name
Japanese:
English:
2018 International Conference on Solid State Devices and Materials (SSDM2018)
Volume, Number, Page
Published date
Sept. 13, 2018
Publisher
Japanese:
English:
Conference name
Japanese:
English:
2018 International Conference on Solid State Devices and Materials (SSDM2018)
Conference site
Japanese:
English:
Tokyo
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Tokyo Institute of Technology All rights reserved.