Heat dissipation measurement technique of semiconductor devices on printed circuit board by using heat flow sensor

Publication Information

Title

Japanese:
English:	Heat dissipation measurement technique of semiconductor devices on printed circuit board by using heat flow sensor

Author

Japanese:	THOMSEN SILVEIRA Joao Vitor, B. Yang, LI ZI DI, 伏信一慶, R. Yasui, 篠田卓也.
English:	J.V. Thomsen Silveira, B. Yang, Z. Li, K. Fushinobu, R. Yasui, T. Shinoda.

Language

English

Journal/Book name

Japanese:	日本機械学会熱工学コンファレンス2018講演論文集
English:

Volume, Number, Page

Published date

Oct. 20, 2018

Publisher

Japanese:
English:

Conference name

Japanese:	日本機械学会熱工学コンファレンス2016
English:

Conference site

Japanese:	富山
English: