Kinetics of reactive diffusion between solid Cu and liquid Sn-0.44Bi alloy | Tokyo Tech Research Repository (T2R2)

Publication Information

Title

Japanese:
English:	Kinetics of reactive diffusion between solid Cu and liquid Sn-0.44Bi alloy

Author

Japanese:	O Minho, 藤田遥, 梶原正憲.
English:	Minho O, Haruka Fujita, Masanori Kajihara.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

Published date

Mar. 2019

Publisher

Japanese:
English:

Conference name

Japanese:	日本金属学会2019年春季(第164回)講演大会
English:

Conference site

Japanese:	東京
English:

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