Japanese
Home
Search
Horizontal Search
Publication Search
( Advanced Search )
Patent Search
( Advanced Search )
Research Highlight Search
( Advanced Search )
Researcher Search
Search by Organization
Support
FAQ
T2R2 User Registration
Doctoral thesis registration
Support/Contact
About T2R2
What's T2R2?
Operation Guidance
Leaflets
About file disclosure
Related Links
Tokyo Tech
STAR Search
NII IR Program
Home
>
Help
Publication Information
Title
Japanese:
English:
High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration
Author
Japanese:
菊地 健彦
,
白 柳
,
御手洗 拓矢
,
八木 英樹
,
雨宮 智宏
,
西山 伸彦
,
荒井 滋久
.
English:
Takehiko Kikuchi
,
Liu Bai
,
Takuya Mitarai
,
Hideki Yagi
,
Tomohiro Amemiya
,
Nobuhiko Nishiyama
,
Shigehisa Arai
.
Language
English
Journal/Book name
Japanese:
English:
Volume, Number, Page
Published date
May 2019
Publisher
Japanese:
English:
Conference name
Japanese:
English:
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019)
Conference site
Japanese:
English:
©2007
Tokyo Institute of Technology All rights reserved.