Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding

Publication Information

Title

Japanese:	Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding
English:	Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding

Author

Japanese:	白柳, 菊地健彦, 御手洗拓矢, 西山伸彦, 八木英樹, 雨宮智宏, 荒井滋久.
English:	Liu Bai, Takehiko Kikuchi, Takuya Mitarai, Nobuhiko Nishiyama, Hideki Yagi, Tomohiro Amemiya, Shigehisa Arai.

Language

Japanese

Journal/Book name

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English:

Volume, Number, Page

Published date

Mar. 2019

Publisher

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Conference name

Japanese:	第66回応用物理会春季学術講演会
English:

Conference site

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English: