Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits

Publication Information

Title

Japanese:	Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits
English:	Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits

Author

Japanese:	白柳, 菊地健彦, 御手洗拓矢, 西山伸彦, 八木英樹, 雨宮智宏, 荒井滋久.
English:	Liu Bai, Takehiko Kikuchi, Takuya Mitarai, Nobuhiko Nishiyama, Hideki Yagi, Tomohiro Amemiya, Shigehisa Arai.

Language

Japanese

Journal/Book name

Japanese:
English:	IEICE technical report

Volume, Number, Page

Vol. 118 No. 348 pp. 149-153

Published date

Dec. 2018

Publisher

Japanese:
English:

Conference name

Japanese:	電子情報通信学会光エレクトロニクス研究会（OPE）
English:

Conference site

Japanese:
English: