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Title
Japanese: 
English:Residual stress determination in SGA layer caused in curing process 
Author
Japanese: 中野内 実典, T Yajima, 原賀 康介, H Uno, 関口悠, 佐藤 千明.  
English: Minori Nakanouchi, T Yajima, K Haraga, H Uno, Yu Sekiguchi, Chiaki Sato.  
Language English 
Journal/Book name
Japanese: 
English: 
Volume, Number, Page        
Published date Sept. 2019 
Publisher
Japanese: 
English: 
Conference name
Japanese: 
English:14th International Triennial Conference on the Science and Technology of Adhesion and Adhesives 
Conference site
Japanese: 
English:Bristol 

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