3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver

Publication Information

Title

Japanese:
English:	3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver

Author

Japanese:	THOMSEN SILVEIRA Joao Vitor, LI ZI DI, 伏信一慶, R. Yasui, 篠田卓也.
English:	J.V. Thomsen Silveira, Z. Li, K. Fushinobu, R. Yasui, T. Shinoda.

Language

English

Journal/Book name

Japanese:	第56回日本伝熱シンポジウム講演論文集
English:

Volume, Number, Page

No. D124

Published date

May 29, 2019

Publisher

Japanese:
English:

Conference name

Japanese:	第56回日本伝熱シンポジウム
English:

Conference site

Japanese:	徳島
English:	Tokushima Pref.