Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement

Publication Information

Title

Japanese:
English:	Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement

Author

Japanese:	牧裕章, 伏信一慶, R. Yasui, 篠田卓也.
English:	H. Maki, K. Fushinobu, R. Yasui, T. Shinoda.

Language

English

Journal/Book name

Japanese:
English:	Proc. ISTP30

Volume, Number, Page

No. ISTP150

Published date

Nov. 1, 2019

Publisher

Japanese:
English:

Conference name

Japanese:
English:	ISTP30

Conference site

Japanese:
English:	Ha Long Bay