Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement | Tokyo Tech Research Repository (T2R2)

Publication Information

Title

Japanese:
English:	Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement

Author

Japanese:	河喜多心哉, 石坂祐樹, 伏信一慶.
English:	S. Kawakita, Y. Ishizaka, K. Fushinobu.

Language

English

Journal/Book name

Japanese:
English:	Proc. ISTP30

Volume, Number, Page

No. ISTP165

Published date

Nov. 1, 2019

Publisher

Japanese:
English:

Conference name

Japanese:
English:	ISTP30

Conference site

Japanese:
English:	Ha Long Bay

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