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Publication Information
Title
Japanese:
English:
Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer
Author
Japanese:
菊地 健彦
,
白 柳
,
御手洗 拓矢
,
八木 英樹
,
古川 将人
,
雨宮 智宏
,
西山 伸彦
,
荒井 滋久
.
English:
Takehiko Kikuchi
,
Liu Bai
,
Takuya Mitarai
,
Hideki Yagi
,
Masato Furukawa
,
Tomohiro Amemiya
,
Nobuhiko Nishiyama
,
Shigehisa Arai
.
Language
English
Journal/Book name
Japanese:
English:
Japanese Journal of Applied Physics
Volume, Number, Page
Volume 59 Number SB pp. SBBD02-1
Published date
Dec. 9, 2019
Publisher
Japanese:
English:
Conference name
Japanese:
English:
Conference site
Japanese:
English:
©2007
Tokyo Institute of Technology All rights reserved.