Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer

Publication Information

Title

Japanese:
English:	Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer

Author

Japanese:	菊地健彦, 白柳, 御手洗拓矢, 八木英樹, 古川将人, 雨宮智宏, 西山伸彦, 荒井滋久.
English:	Takehiko Kikuchi, Liu Bai, Takuya Mitarai, Hideki Yagi, Masato Furukawa, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai.

Language

English

Journal/Book name

Japanese:
English:	Japanese Journal of Applied Physics

Volume, Number, Page

Volume 59 Number SB pp. SBBD02-1

Published date

Dec. 9, 2019

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English: