ハイブリッド集積に向けたDirect Transfer Bondingによる接合位置精度の検討

Publication Information

Title

Japanese:	ハイブリッド集積に向けたDirect Transfer Bondingによる接合位置精度の検討
English:	Bonding Position Accuracy of Direct Transfer Bonding, Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration

Author

Japanese:	小野寺広夢, 菊地健彦, 大礒義孝, 雨宮智宏, 西山伸彦.
English:	Hiromu Onodera, Takehiko Kikuchi, Yoshitaka Oiso, Tomohiro Amemiya, Nobuhiko Nishiyama.

Language

Japanese

Journal/Book name

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Volume, Number, Page

Published date

Sept. 10, 2021

Publisher

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Conference name

Japanese:	第82回応用物理学会秋季学術講演会
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Conference site

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