Bonding Position Accuracy of Direct Transfer Bonding,  Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration

Publication Information

Title

Japanese:
English:	Bonding Position Accuracy of Direct Transfer Bonding, Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration

Author

Japanese:	小野寺広夢, 菊地健彦, 大礒義孝, 雨宮智宏, 西山伸彦.
English:	Hiromu Onodera, Takehiko Kikuchi, Yoshitaka Oiso, Tomohiro Amemiya, Nobuhiko Nishiyama.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

Published date

Oct. 2021

Publisher

Japanese:
English:

Conference name

Japanese:
English:	7th International Workshop on Low Temperature Bonding for 3D Integration

Conference site

Japanese:
English: