【IMPORTANT】T2R2 and STAR Search: Service Discontinuation and Successor Systems Japanese

Home > Help Publication Information Title Japanese:   English: Bonding Position Accuracy of Direct Transfer Bonding, Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration  Author Japanese: 小野寺広夢, 菊地健彦, 大礒義孝, 雨宮智宏, 西山伸彦.   English: Hiromu Onodera, Takehiko Kikuchi, Yoshitaka Oiso, Tomohiro Amemiya, Nobuhiko Nishiyama.   Language English  Journal/Book name Japanese:   English:   Volume, Number, Page         Published date Oct. 2021  Publisher Japanese:   English:   Conference name Japanese:   English: 7th International Workshop on Low Temperature Bonding for 3D Integration  Conference site Japanese:   English:

©2007 Institute of Science Tokyo All rights reserved.