CuとSn-0.44Bi共晶合金のリフロー接合界面における反応拡散

Publication Information

Title

Japanese:	CuとSn-0.44Bi共晶合金のリフロー接合界面における反応拡散
English:	Reactive diffusion at the bonding interface between Cu and eutectic Sn-Bi alloy by reflow

Author

Japanese:	田中佑樹, O Minho, 小林郁夫.
English:	Yuki Tanaka, Minho O, Equo Kobayashi.

Language

Japanese

Journal/Book name

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English:

Volume, Number, Page

Published date

Mar. 2022

Publisher

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English:

Conference name

Japanese:	日本金属学会2022年春季(第170回)講演大会
English:	The Japan Institute of Metals and Materials 170th annual spring meeting

Conference site

Japanese:
English: