In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement

Publication Information

Title

Japanese:
English:	In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement

Author

Japanese:	LI ZI DI, 羽毛田洸之, 伏信一慶, 安井龍太, 篠田卓也.
English:	Z. Li, H. Haketa, K. Fushinobu, R. Yasui, T. Shinoda.

Language

English

Journal/Book name

Japanese:
English:	Microelectronics Reliability

Volume, Number, Page

Vol. 123

Published date

2021

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI