CNT添加によるSn-Ag-CuとCuの接合界面における影響

Publication Information

Title

Japanese:	CNT添加によるSn-Ag-CuとCuの接合界面における影響
English:	Effect of MWCNT on the growth behavior of the compound at Sn-Ag-Cu solder joints

Author

Japanese:	岩本紘佳, O Minho, 小林郁夫.
English:	Hiroka Iwamoto, Minho O, Equo Kobayashi.

Language

Japanese

Journal/Book name

Japanese:
English:

Volume, Number, Page

Published date

Sept. 2022

Publisher

Japanese:
English:

Conference name

Japanese:	日本金属学会2022年秋期(第171回)講演大会
English:	The Japan Institute of Metals and Materials 171th annual fall meeting

Conference site

Japanese:	福岡
English:	Fukuoka