Co-Packaged and PIC for Data Center Applications | Science Tokyo Research Repository (T2R2)

Publication Information

Title

Japanese:
English:	Co-Packaged and PIC for Data Center Applications

Author

Japanese:	小山二三夫.
English:	FUMIO KOYAMA.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

Tu2E.1

Published date

Mar. 7, 2023

Publisher

Japanese:
English:

Conference name

Japanese:
English:	Optical Fiber Communication Conference 2023

Conference site

Japanese:
English:	San Diego

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