Package’s Solder Crack Detection Technique by Thermal Resistance | Tokyo Tech Research Repository (T2R2)

Publication Information

Title

Japanese:
English:	Package’s Solder Crack Detection Technique by Thermal Resistance

Author

Japanese:	Xie Centian, 伏信一慶, 安井龍太, 篠田卓也.
English:	Xie Centian, K. Fushinobu, R. Yasui, T. Shinoda.

Language

English

Journal/Book name

Japanese:	第60回日本伝熱シンポジウム講演論文集
English:

Volume, Number, Page

Published date

May 2023

Publisher

Japanese:
English:

Conference name

Japanese:	第60回日本伝熱シンポジウム
English:

Conference site

Japanese:	福岡
English:

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