Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures

Publication Information

Title

Japanese:
English:	Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures

Author

Japanese:	O Minho, 田中佑樹, 小林郁夫.
English:	Minho O, Yuki Tanaka, Equo Kobayashi.

Language

English

Journal/Book name

Japanese:
English:	Intermetallics

Volume, Number, Page

Volume 161 107986

Published date

Oct. 2023

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI