CuとSn-Bi共晶合金の接合界面における反応拡散

Publication Information

Title

Japanese:	CuとSn-Bi共晶合金の接合界面における反応拡散
English:	Reactive diffusion between Cu and eutectic Sn-Bi alloy

Author

Japanese:	O Minho, 田中佑樹, 小林郁夫.
English:	Minho O, Yuki Tanaka, Equo Kobayashi.

Language

Japanese

Journal/Book name

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English:

Volume, Number, Page

Published date

Sept. 2023

Publisher

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English:

Conference name

Japanese:	日本金属学会2023年秋期(第173回)講演大会
English:	2023 JIMM autumn meeting (173rd)

Conference site

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English: