Solder Crack Detection Technique of MLCC by Means of Thermal Resistance Measurement

Publication Information

Title

Japanese:	Solder Crack Detection Technique of MLCC by Means of Thermal Resistance Measurement
English:	Solder Crack Detection Technique of MLCC by Means of Thermal Resistance Measurement

Author

Japanese:	Xie Centian, Liu Yung Chi, 伏信一慶, R. Yasui, 篠田卓也.
English:	C. Xie, Y. Liu, K. Fushinobu, R. Yasui, T. Shinoda.

Language

Japanese

Journal/Book name

Japanese:	第60回日本伝熱シンポジウム講演論文集
English:

Volume, Number, Page

I123

Published date

May 25, 2023

Publisher

Japanese:
English:

Conference name

Japanese:	第60回日本伝熱シンポジウム
English:

Conference site

Japanese:	福岡
English: