Development of Low-Loss and Low-Cost Air-Filled Transmission Lines based on Advanced Glass Wafer Packaging

Publication Information

Title

Japanese:
English:	Development of Low-Loss and Low-Cost Air-Filled Transmission Lines based on Advanced Glass Wafer Packaging

Author

Japanese:	Jing Cai, 張淼, Daquan Yu, 廣川二郎.
English:	Jing Cai, Miao Zhang, Daquan Yu, Jiro Hirokawa.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

Published date

Apr. 2024

Publisher

Japanese:
English:

Conference name

Japanese:
English:	Intl. Workshop Antenna Tech.

Conference site

Japanese:
English: