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Publication Information
Title
Japanese:
6Gに向けた150GHz帯超小型3次元積層モジュールの要素技術
English:
Author
Japanese:
森下 陽平
,
枷場 亮祐
, 村田 智洋,
滝波 浩二
,
村山 啓
,
岡田 健一
,
原 紳介
.
English:
Yohei Morishita
,
Ryosuke Hasaba
, 村田 智洋,
Koji Takinami
,
村山 啓
,
Kenichi Okada
,
Shinsuke Hara
.
Language
Japanese
Journal/Book name
Japanese:
English:
Volume, Number, Page
Published date
Mar. 2024
Publisher
Japanese:
English:
Conference name
Japanese:
電子情報通信学会 総合大会
English:
Conference site
Japanese:
English:
広島大学
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Tokyo Institute of Technology All rights reserved.