Deposition and evaluation of mechanical and antimicrobial properties of multilayered Cu-DLC films with segmented structure

Publication Information

Title

Japanese:
English:	Deposition and evaluation of mechanical and antimicrobial properties of multilayered Cu-DLC films with segmented structure

Author

Japanese:	LI YUCHENG, 古賀千晶, 平田祐樹, 赤坂大樹, 金高弘恭, 大竹尚登.
English:	Yucheng Li, Chiaki Koga, Yuki Hirata, Hiroki Akasaka, Hiroyasu Kanetaka, Naoto Ohtake.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

Published date

Sept. 2024

Publisher

Japanese:
English:

Conference name

Japanese:
English:	34th International Conference on Diamond and Carbon Materials

Conference site

Japanese:
English:	Dresden