The increasingly highly doped, conductive substrates resulting in lossy on-chip passive components is one of
the main drawbacks of standard CMOS processes which worsens with moving toward higher frequencies like 60
GHz. Realizing of an on-chip 3-dB quadrature coupler at 60 GHz is impractical due to its large size and hence
high loss, though it's a key component in various circuits such as balanced amplifiers and balanced mixers. In
this paper for overcoming the problem, we have used WLP (Wafer Level Packaging) technology and proposed a
new tandem coupler using offset broadside coupled lines for power combining in 60 GHz band.
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