A 60 GHz tandem coupler using offset broadside coupled lines is proposed in a WLP
(Wafer Level Packaging) technology. The fabricated coupler has a core chip area of 750 μm ×
385 μm (0.288 mm2). The measured results show an insertion loss of 0.44 dB, an amplitude
imbalance of 0.03 dB and a phase difference of 87.6° at 60 GHz. Also the measurement shows an
insertion loss of less than 0.67 dB, an amplitude imbalance of less than 0.31 dB, a phase error of
less than 3.7°, an isolation of more than 29.7 dB and a return loss of more than 27.9 dB at the
input ant coupled ports and more than 14.3 dB at the direct and isolated ports over the frequency
band of 57-66 GHz, covering 60 GHz band both in Japan and US. To the best of our knowledge
the proposed coupler achieves the lowest ever reported insertion loss and amplitude imbalance
for a 3-dB coupler on a silicon substrate. With its superior performance and lower cost compared
to the CMOS counterparts, the proposed coupler is a suitable candidate for low-cost highperformance
millimeter-wave systems.
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