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タイトル
和文: 
英文:Multiscale seamless domain method for linear elastic and steady temperature problems 
著者
和文: 鈴木 良郎.  
英文: Yoshiro Suzuki.  
言語 English 
掲載誌/書名
和文: 
英文: 
巻, 号, ページ        
出版年月 2014年 
出版者
和文: 
英文: 
会議名称
和文: 
英文:The International Conference on Computational Methods (ICCM) 
開催地
和文: 
英文:Cambridge 
アブストラクト A new meshfree numerical analysis, termed the seamless domain method (SDM), is applied in a multiscale technology. The SDM requires only coarse-grained points and does not need a stiffness equation, mesh, grid, cell, or element. The SDM is composed of two analyses. The first is a microscopic analysis of local simulation domain to obtain shape functions for interpolation of dependent-variable distributions and influence coefficients for calculation of interaction between the points. These allow an SDM solution to represent a heterogeneous material without homogenization. The second step is a macroscopic analysis of a seamless global domain without mesh or grid. Various numerical examples illustrated that the method worked out both steady temperature fields and linear elastic fields. Every SDM solution using only a few hundreds of points was as accurate as that from conventional finite element analysis using more than 200 thousands of node points.

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