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タイトル
和文: 
英文:In-situ realtime monitoring of nanoscale gold electroplating using micro-electro-mechanical systems liquid cell operating in transmission electron microscopy 
著者
和文: 江川実, 石田忠, Laurent Jalabert, 藤田博之.  
英文: Minoru Egawa, Tadashi Ishida, Laurent Jalabert, Hiroyuki Fujita.  
言語 English 
掲載誌/書名
和文: 
英文:Applied Physics Letters 
巻, 号, ページ Vol. 108       
出版年月 2016年1月11日 
出版者
和文: 
英文:American Institute of Physics 
会議名称
和文: 
英文: 
開催地
和文: 
英文: 
DOI https://doi.org/10.1063/1.4939771
アブストラクト The dynamics of nanoscale electroplating between goldelectrodes was investigated using a microfabricated liquid cell mounted on a scanning transmission electron microscope. The electroplating was recorded in-situ for 10 min with a spatial resolution higher than 6 nm. At the beginning of the electroplating,gold spike-like structures of about 50 nm in size grew from an electrode, connected gold nanoclusters around them, and form three dimensional nanoscale structures. We visualized the elementary process of the goldelectroplating, and believe that the results lead to the deeper understanding of electroplating at the nanoscale.

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