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研究業績一覧 (2件)
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国際会議発表 (査読有り)
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Kazuma Ohashi,
Yuka Kobayashi,
Hiroyuki Ito,
Kenichi Okada,
Hideki Hatakeyama,
Takuya Aizawa,
Tatsuya Ito,
Ryozo Yamauchi,
Kazuya Masu.
A Low Phase Noise LC-VCO with a High-Q Inductor Fabricated by Wafer Level Package Technology,
Radio Frequency Integrated Circuits Symposium 2008 (RFIC 2008),
Radio Frequency Integrated Circuits Symposium 2008 (RFIC 2008),
pp. 123-126,
June 2008.
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Tomoaki Maekawa,
Takahiro Ishii,
Junki Seita,
Hiroyuki Ito,
Kenichi Okada,
Hideki Hatakeyama,
Y.Uemichi,
Tatsuya Ito,
Ryozo Yamauchi,
Kazuya Masu.
A Low-Power Differential Transmission Line Interconnect using Wafer Level Package Technology,
IEEE Workshop on Signal Propagation on Interconnects (SPI),
IEEE Workshop on Signal Propagation on Interconnects (SPI),
May 2008.
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