国際会議発表 (査読有り)

• Kazuma Ohashi, Yuka Kobayashi, Hiroyuki Ito, Kenichi Okada, Hideki Hatakeyama, Takuya Aizawa, Tatsuya Ito, Ryozo Yamauchi, Kazuya Masu. A Low Phase Noise LC-VCO with a High-Q Inductor Fabricated by Wafer Level Package Technology, Radio Frequency Integrated Circuits Symposium 2008 (RFIC 2008), Radio Frequency Integrated Circuits Symposium 2008 (RFIC 2008), pp. 123-126, June 2008.
• Tomoaki Maekawa, Takahiro Ishii, Junki Seita, Hiroyuki Ito, Kenichi Okada, Hideki Hatakeyama, Y.Uemichi, Tatsuya Ito, Ryozo Yamauchi, Kazuya Masu. A Low-Power Differential Transmission Line Interconnect using Wafer Level Package Technology, IEEE Workshop on Signal Propagation on Interconnects (SPI), IEEE Workshop on Signal Propagation on Interconnects (SPI), May 2008.

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