論文

• Yi-Chieh Tsai, Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Han-Wen Hu, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, Kuan-Neng Chen. Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via, IEEE Transactions on Electron Devices, Vol. 68, No. 7, pp. 3520 - 3525, July 2021.
• Yi-Lun Yang, Hiroyuki Ito, Kim Youngsuk, Takayuki Ohba, Kuan-Neng Chen. Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3D Integration, IEEE Transactions on Components, Packaging and Manufacturing Technology, Jan. 2020.

国際会議発表 (査読有り)

• Yi-Lun Yang, Jia-Ling Liu, Guan Wei Chen, Shoichi Kodama, Kyosuke Kobinata, Kuan-Neng Chen, Hiroyuki Ito, Kim Youngsuk, Takayuki Ohba. Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation, International Conference on Electronics Packaging, pp. 28-31, Apr. 2019.

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