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Publication List - Tomoji Nakamura 2023 (5 / 25 entries)
Journal Paper
International Conference (Reviewed)
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Norio Chujo,
Hiroyuki Ryoson,
Koji Sakui,
Shinji Sugatani,
Tomoji Nakamura,
Takayuki Ohba.
Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
IEEE,
Aug. 2023.
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Norio Chujo,
Koji Sakui,
Shinji Sugatani,
Hiroyuki Ryoson,
Tomoji Nakamura,
Takayuki Ohba.
Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy,
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
July 2023.
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T. Kudo,
Y. Satake,
T. Funaki,
N. Araki,
Z. Chen,
T. Nakamura,
T. Ohba.
Study of High-Speed Bonding Process with Thin Adhesive for Chiplet Heterogenous Integration,
2023 International Conference on Electronics Packaging (ICEP),
May 2023.
Domestic Conference (Not reviewed / Unknown)
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