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篠田卓也 2019年 研究業績一覧 (8件 / 32件)
国際会議発表 (査読有り)
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T. Shinoda,
R. Yasui,
W. Woo,
K. Fushinobu,
T. Tomimura.
Influence of two screw fastening distances on contact thermal resistance,
ISTP30,
Proc. ISTP30,
No. ISTP021,
Nov. 2019.
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Z. Li,
J.V. Thomsen Silveira,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Heat dissipation measurement of multiple electronic components on ECU by means of external heater and heat flux sensor,
ISTP30,
Proc. ISTP30,
No. ISTP134,
Nov. 2019.
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J.V. Thomsen Silveira,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Transient thermal response investigation of multiple heat-source electronic systems,
ISTP30,
Proc. ISTP30,
No. ISTP212,
Nov. 2019.
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H. Maki,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement,
ISTP30,
Proc. ISTP30,
No. ISTP150,
Nov. 2019.
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J.V. Thomsen Silveira,
Z. Li,
B. Yang,
R. Yasui,
T. Shinoda,
K. Fushinobu.
Analysis of heat transfer from a heat dissipating device on a substrate,
ITherm 2019,
Proc. ITherm2019,
No. 400,
May 2019.
国内会議発表 (査読なし・不明)
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J.V. Thomsen Silveira,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver,
第56回日本伝熱シンポジウム,
第56回日本伝熱シンポジウム講演論文集,
No. D124,
May 2019.
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Z. Li,
J.V. Thomsen Silveira,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Heat dissipation measurement of electronic component by means of external heater and heat flux sensor,
第56回日本伝熱シンポジウム,
第56回日本伝熱シンポジウム講演論文集,
No. D112,
May 2019.
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篠田 卓也,
安井 竜太,
K. Karjadi,
伏信 一慶,
富村 寿夫.
大きなうねりを有する固体間の接触熱抵抗の測定手法,
第56回日本伝熱シンポジウム,
第56回日本伝熱シンポジウム講演論文集,
No. D111,
May 2019.
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