学位論文

• Embedded Die and Fan-Out Packaging Technologies Enabling High Density and Reliable 2D/3D Integration for System in Package,  Thesis,  Doctor (Engineering),  Tokyo Institute of Technology,  2022/03/26,   
• Embedded Die and Fan-Out Packaging Technologies Enabling High Density and Reliable 2D/3D Integration for System in Package,  Summary,  Doctor (Engineering),  Tokyo Institute of Technology,  2022/03/26,   
• Embedded Die and Fan-Out Packaging Technologies Enabling High Density and Reliable 2D/3D Integration for System in Package,  Exam Summary,  Doctor (Engineering),  Tokyo Institute of Technology,  2022/03/26,   

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