Journal Paper

• Keiyu Ikeda, Yu Sekiguchi, Kazumasa Shimamoto, Chiaki Sato. Fracture Energy Determination of Wedge-opening Double Cantilever Beam Tests, The Journal of Adhesion, Taylor & Francis, Online first version, Nov. 2024.  Official location  
• Han Jinwoo, Yu Sekiguchi, Kazumasa Shimamoto, Haruhisa Akiyama, Chiaki Sato. Direct Measurement of the Diffusion Coefficient of Adhesives from Moisture Distribution in Adhesive Layers Using Near-Infrared Spectroscopy, ACS Applied Materials & Interfaces, ACS Publications, Vol. 16, Issue 40, pp. 54610-54626, Sept. 2024.  Official location  
• Shinya Iizuka, Yu Sekiguchi, Chiaki Sato. Measurement of the water vapor transmission rate at temperatures above 100 °C, The Journal of Adhesion, Taylor & Francis, Online first version, Aug. 2024.  Official location  
• Jin Woo Han, Yu Sekiguchi, Kazumasa Shimamoto, Haruhisa Akiyama, Chiaki Sato. Experimental investigation of moisture penetration in adhesive layers under varying bonding conditions using near-infrared spectroscopy, International Journal of Adhesion and Adhesives, Elsevier, Vol. 134, 103792, July 2024.  Official location  
• Keiji Houjou, Kazumasa Shimamoto, Haruhisa Akiyama, Yu Sekiguchi, Chiaki Sato. Analytical Calculation of Relationship Temperature and Fatigue and Creep Strength Based on Thermal Activation, Materials, MDPI, Vol. 17, Issue 13, 3055, June 2024.  Official location  
• Akihiro Maesaka, Yushin Kakei, Tsutomu Osaka, Yoshihiro Kudo, Yu Sekiguchi, Chiaki Sato. Experimental approach for measuring the peeling strength of a sheet bonded on a curved adherend with pressure sensitive adhesive and predicting the peeling resistance by finite element analysis, The Journal of Adhesion, Taylor & Francis, Vol. 100, No. 16, pp. 1554-1569, Mar. 2024.  Official location  
• Ming Ji, Chao Kang, Yu Sekiguchi, Masanobu Naito, Chiaki Sato. Spectral collocation method for free vibration of sandwich plates containing a viscoelastic core, Composite Structures, Elsevier, Vol. 337, 118024, Mar. 2024.  Official location  

Domestic Conference (Not reviewed / Unknown)

• Yu Sekiguchi. Reliability evaluation of adhesively bonded joints and application to structural parts, 第73回高分子学会年次大会, Polymer Preprints, Japan, 公益社団法人 高分子学会, Vol. 73, No. 1, 1J20ILY, June 2024.

Patent

• CHIAKI SATO, Goh Matsuo, Yu Sekiguchi. 界面破壊率測定装置、及び界面破壊率測定方法. Patent. Published. 国立大学法人東京工業大学, 国立研究開発法人 物質・材料研究機構. 2023/07/27. PCT/JP2023/027482. 2024/02/01. WO 2024/024870. 2024.
• CHIAKI SATO, Yu Sekiguchi. せん断強度測定装置、及びせん断強度測定システム. Patent. Registered. 国立大学法人東京工業大学, 国立研究開発法人 物質・材料研究機構. 2020/12/22. 特願2020-211990. 2022/07/04. 特開2022-98555. 特許第7527552号. 2024/07/26 2024.

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