|
Publication List - Kuan-Neng Chen (3 entries)
- 2028
- 2027
- 2026
- 2025
- 2024
- All
Journal Paper
-
Yi-Chieh Tsai,
Chia-Hsuan Lee,
Hsin-Chi Chang,
Jui-Han Liu,
Han-Wen Hu,
Hiroyuki Ito,
Young Suk Kim,
Takayuki Ohba,
Kuan-Neng Chen.
Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via,
IEEE Transactions on Electron Devices,
Vol. 68,
No. 7,
pp. 3520 - 3525,
July 2021.
-
Yi-Lun Yang,
Hiroyuki Ito,
Kim Youngsuk,
Takayuki Ohba,
Kuan-Neng Chen.
Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3D Integration,
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Jan. 2020.
International Conference (Reviewed)
-
Yi-Lun Yang,
Jia-Ling Liu,
Guan Wei Chen,
Shoichi Kodama,
Kyosuke Kobinata,
Kuan-Neng Chen,
Hiroyuki Ito,
Kim Youngsuk,
Takayuki Ohba.
Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation,
International Conference on Electronics Packaging,
pp. 28-31,
Apr. 2019.
[ Save as BibTeX ]
[ Paper, Presentations, Books, Others, Degrees: Save as CSV
]
[ Patents: Save as CSV
]
|