国際会議発表 (査読有り)

• Norio Chujo, Hiroyuki Ryoson, Koji Sakui, Shinji Sugatani, Tomoji Nakamura, Takayuki Ohba. Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), IEEE, Aug. 2023.
• Norio Chujo, Koji Sakui, Shinji Sugatani, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba. Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy, 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), July 2023.

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