International Conference (Reviewed)

• Tatsuhiko Mori, Tomoyuki Kurioka, Chun-Yi Chen, Tso-Fu Mark Chang, Katsuyuki Machida, Hiroyuki Ito, Yoshihiro Miyake, Masato Sone. Evaluation of Warpage Behavior of an Octagonal Electrodeposited-Au Proof Mass with a Ti/Au Multi-Layered Structures caused by Thermal Treatment, CPIT2024, New Method of Damage and Failure Analysis of Structural Part, CPIT2024, New Method of Damage and Failure Analysis of Structural Part, Oct. 2024.
• Tatsuhiko Mori, Tomoyuki Kurioka, Chun-Yi Chen, Tso-Fu Mark Chang, Katsuyuki Machida, Hiroyuki Ito, Yoshihiro Miyake, Masato Sone. Thermal Treatment Effects on Warpage of an Octagonal Electrodeposited-Au Proof Mass with a Ti/Au Multi-layered Structure Toward High-sensitive Accelerometers, 50th International Micro and Nano Engineering Conference (MNE 2024 Montpellier), 50th International Micro and Nano Engineering Conference (MNE 2024 Montpellier), Sept. 2024.

Domestic Conference (Reviewed)

• Tatsuhiko Mori, Tomoyuki Kurioka, Chun Yi Chen, Tso-Fu Mark Chang, Katsuyuki Machida, Hiroyuki Ito, Yoshihiro Miyake, Masato Sone. Evaluation of the Effects of Heat Treatment Temperature on Warpage Deformation of the Ti/Au Multi-layered Electrodeposited-Au Proof Mass, The 71st JSAP Spring Meeting 2024, Proc. The 71st JSAP Spring MeetinProc., p. 23a-12K-2, Mar. 2024.

[ Save as BibTeX ]    [ Paper, Presentations, Books, Others, Degrees: Save as CSV ]    [ Patents: Save as CSV ]