Journal Paper

• Sangyeop Lee, Shuhei Amakawa, Takeshi Yoshida, Minoru Fujishima. A 0.4-V 29-GHz-bandwidth power-scalable distributed amplifier in 55-nm CMOS DDC process, Oct. 2022.
• Shinsuke Hara, Ruibing Dong, Sangyeop Lee, Kyoya Takano, Naoya Toshida, Akifumi Kasamatsu, Kunio Sakakibara, Takeshi Yoshida, Shuhei Amakawa, Minoru Fujishima. A 76-Gbit/s 265-GHz CMOS receiver with WR-3.4 waveguide interface, IEEE Journal of Solid-State Circuits, July 2022.

International Conference (Reviewed)

• Sangyeop Lee, Masao Fujita, Masayuki Toyoda, Kyoya Takano, Shinsuke Hara, Watanabe Issei, Akifumi Kasamatsu, Shuhei Amakawa, Takeshi Yoshida, Hiroyuki Ito. A transparent band-pass-filtered reflector for IEEE Standard 802.15.3d, IEEE Asia-Pacific Microwave Conference, Nov. 2022.
• Zixuan Li, Sangyeop Lee, Noboru Ishihara, Hiroyuki Ito. Low-jitter CMOS inverter-based RC oscillator with voltage-integration feedback for sensor interface, International Conference on Solid State Devices and Materials (SSDM), Sept. 2022.
• Sangyeop Lee, Masao Fujita, Masayuki Toyoda, Kyoya Takano, Shinsuke Hara, Watanabe Issei, Akifumi Kasamatsu, Hiroyuki Ito. Sub-terahertz electromagnetic-wave absorber for future wireless communication, IEEE International Symposium on Frequency Integration Technology, Aug. 2022.
• Masao Fujita, Sangyeop Lee, Kyoya Takano, Masayuki Toyoda, Shinsuke Hara, Watanabe Issei, Akifumi Kasamatsu. Development of Terahertz EM-wave Absorber, IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition, Aug. 2022.
• Sangyeop Lee, Masao Fujita, Masayuki Toyoda, Kyoya Takano, Shinsuke Hara, Issei Watanabe, Akifumi Kasamatsu, Hiroyuki Ito. Ultra-wideband electromagnetic-wave absorber for IEEE 802.15.3d, Global Symposium on Millimeter Waves, May 2022.
• Sangyeop Lee, Kosuke Katayama, Kyoya Takano, Masao Fujita, Masayuki Toyoda, Shinsuke Hara, Issei Watanabe, Akifumi Kasamatsu, Shuhei Amakawa, Takeshi Yoshida, Minoru Fujishima. 300-GHz back-radiation on-chip-antenna measurement with electromagnetic-wave-absorption sheet, IEEE International Conference on Microelectronic Test Structures, Mar. 2022.

International Conference (Not reviewed / Unknown)

• Shuhei Amakawa, Ryotaro Sugimoto, Korkut Kaan Tokgoz, Sangyeop Lee, Hiroyuki Ito. Signal-flow-graph analysis of weakly nonlinear RF circuits, International Symposium on Biomedical Engineering, Nov. 2022.
• Sangyeop Lee, Yohei Morishita, Shuhei Amakawa, Takeshi Yoshida, Minoru Fujishima. 300-GHz self-heterodyne-mixing-receiver-based wireless data transmission, IEEE International Symposium on Frequency Integration Technology, Aug. 2022.
• Sangyeop Lee, Shuhei Amakawa, Takeshi Yoshida, Minoru Fujishima. A 300-GHz analog-demodulation CMOS receiver for IEEE 802.15.3d, Global Symposium on Millimeter Waves, May 2022.

Domestic Conference (Not reviewed / Unknown)

• Sangyeop Lee, Masao Fujita, Kyoya Takano, Shinsuke Hara, Watanabe Issei, Akifumi Kasamatsu, Hiroyuki Ito. 300GHz帯広帯域電波吸収体の研究開発, シンポジウム「テラヘルツ科学の最先端Ⅸ」, Nov. 2022.
• Sangyeop Lee, Masao Fujita, Masayuki Toyoda, Kyoya Takano, Shinsuke Hara, Issei Watanabe, Akifumi Kasamatsu, Hiroyuki Ito. 誘電体のテラヘルツ帯測定結果による電波吸収体設計, 電子情報通信学会マイクロ波研究会, Mar. 2022.
• Shuhei Amakawa, Sangyeop Lee, Korkut Kaan Tokgoz, Hiroyuki Ito. Circuit design and device modeling for biomedical applications, 令和3年度生体医歯工学共同研究拠点成果報告会, Mar. 2022.
• Sangyeop Lee, Kei Sasaki, Hiyonsu Kimu. 通信と建築の発展速度ギャップを融合した未来の暮らし, DLab Dialog Days 2022, Mar. 2022.
• Masao Fujita, Masayuki Toyoda, Sangyeop Lee, Shinsuke Hara, Issei Watanabe, Akifumi Kasamatsu, Kyoya Takano. 超高周波帯電波吸収シートの設計指針とその開発, 電子情報通信学会総合大会, Mar. 2022.
• Zhiyang Gong, Sangyeop Lee, Noboru Ishihara, Hiroyuki Ito. A divide-by-18 injection locked frequency divider based on harmonic rejection, 電子情報通信学会総合大会, Mar. 2022.
• Sangyeop Lee. 未来通信と建築の相互デザインシナリオ, Beyond 5G 研究開発ワークショップ, Feb. 2022.
• Sangyeop Lee. テラヘルツ帯位相雑音キャンセル機能付きトランシーバ開拓, Beyond 5G 研究開発ワークショップ, Feb. 2022.

Patent

• Sangyeop Lee. 電波反射体. Patent. Published. 国立大学法人東京工業大学, 国立研究開発法人情報通信研究機構, マクセル株式会社, 学校法人東京理科大学. 2022/03/10. 特願2022-037191. 2023/09/22. 特開2023-132077. 2023.
• Sangyeop Lee. 電波吸収体. Patent. Published. 国立大学法人東京工業大学, 国立研究開発法人情報通信研究機構, マクセル株式会社, 学校法人東京理科大学. 2022/03/10. 特願2022-037190. 2023/09/22. 特開2023-132076. 2023.

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