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Publication List - Takayuki Ohba 2016 (1 / 45 entries)
International Conference (Reviewed)
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Y. S. Kim,
S. Kodama,
Y. Mizushima,
T. Nakamura,
N. Maeda,
K. Fujimoto,
A. Kawai,
T. Ohba.
Warpage-free Ultra-Thinning ranged from 2 to 5-μm for DRAM Wafers and Evaluation of Devices Characteristics,
2016 IEEE 66th Electronic Components and Technology Conference,
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th,
IEEE,
pp. 1471-1476,
June 2016.
Patent
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Takayuki Ohba.
半導体装置の製造方法.
Patent.
Registered.
国立大学法人東京工業大学.
2014/09/16.
特願2014-187540.
2016/04/25.
特開2016-062951.
特許第6485897号.
2019/03/01
2019.
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