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Publication List - Kim Youngsuk 2014 (3 / 8 entries)
Journal Paper
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Mizushima Yoriko,
Kim Youngsuk,
Nakamura Tomoji,
Sugie Ryuichi,
Hashimoto Hideki,
Uedono Akira,
Ohba Takayuki.
Impact of back-grinding-induced damage on Si wafer thinning for three-dimensional integration,
Jpn. J. Appl. Phys.,
Institute of Physics,
Vol. 53,
No. 5,
Apr. 2014.
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Noriyuki Taoka,
Osamu Nakatsuka,
Yoriko Mizushima,
Hideki Kitada,
Young Suk Kim,
Tomoji Nakamura,
Takayuki Ohba,
Shigeaki Zaima.
Observation of lattice spacing fluctuation and strain undulation around through-Si vias in wafer-on-wafer structures using X-ray microbeam diffraction,
Japanese Journal of Applied Physics,
Volume 53,
Apr. 2014.
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Akira Uedono,
Yoriko Mizushima,
Youngsuk Kim,
Tomoji Nakamura,
Takayuki Ohba,
Nakaaki Yoshihara,
Nagayasu Oshima,
Ryoichi Suzuki.
Vacancy-type defects induced by grinding of Si wafers studied by monoenergetic,
Journal of Applied Physics,
AIP,
Vol. 116,
134501,
2014.
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