論文

• Xun Gu, Takenao Nemoto, Akinobu Teramoto, Takashi Ito, Tadahiro Ohmi. Effect of Additives in Organic Acid Solutions for Post-CMP Cleaning on Polymer Low-k Fluorocarbon, J. Electrochem. Soc., J. Electrochem. Soc., Vol. 156, No. 6, pp. H409-H415, June 2009.
• Katsumasa Suzuki, Yoshio Ishihara, Kaoru Sakoda, Yasuyuki Shirai, Akinobu Teramoto, Masaki Hirayama, Tadahiro Ohmi, Takayuki Watanabe, Takashi Ito. Inductively coupled plasma generator for an environmentally benign perfluorocarbon abatement system, J. Vac. Sci. Technol. A, J. Vac. Sci. Technol. A, Vol. A27, No. 3, pp. 465-470, Mar. 2009.
• Katsumasa Suzuki, Yoshio Ishihara, Kaoru Sakoda, Yasuyuki Shirai, Akinobu Teramoto, Masaki Hirayama, Tadahiro Ohmi, Takayuki Watanabe, Takashi Ito. High-Efficiency PFC Abatement System Utilizing High-Efficiency PFC Abatement System Utilizing Immobilization, IEEE Trans. on Semicon. Manufacturing, IEEE, Vol. 21, No. 4, pp. 668-675, Nov. 2008.
• Tadahiro Ohmi, Hiraku ISHIKAWA, Toshihisa NOZAWA, Takaaki MATSUOKA, Akinobu TERAMOTO, Masaki HIRAYAMA, Takashi ITO, Tadahiro OHMI. Evaluation of New Amorphous Hydrocarbon Film for Copper Barrier Dielectric Film in Low-k Copper Metallization, Japanese Journal of Applied Physics, The Japan Society of Applied Physics, Vol. 47, No. 4, pp. 2531–2534, Apr. 2008.
• Takenao Nemoto, Hiroshi Imai, Akinobu Teramoto, Takashi Ito, Shigetoshi Sugawa, Tadahiro Ohmi. Tantalum Nitride Sputtering Deposition with Xe on Fluorocarbon for Cu Interconnections, Journal of The Electrochemical Society, The Electrochemical Society, Vol. 155, No. 5, pp. H323-H328, Mar. 2008.

国際会議発表 (査読有り)

• S.Morishita, T.Goto, I.Akutsu, K.Ohyama, T.Ito, T.Ohmi. High-Speed Gas Replacement in Plasma Process Chamber due to Precise Down-Flow of Gas Using a Upper Shower Plate, 30th International Symposium on Dry Process, Dry Process International Symposium （DPS2008）, 30th International Symposium on Dry Process, pp. 63-64, Nov. 2008.
• Sadaharu Morishita, Tetsuya Goto, Takashi Ito, Tadahiro Ohmi. Study on Gas Replacement Time in Plasma Process Chamber for Realizing Ideal Down Flow of Gas without Disturbance, Int. Symp. on Semicon. Manufacturing 2008 (ISSM2008), Int. Symp. on Semicon. Manufacturing 2008 (ISSM2008), Int. Symp. on Semicon. Manufacturing 2008 (ISSM2008), pp. 177-180, Oct. 2008.

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