国際会議発表 (査読有り)

• Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Takuya Aizawa, Oasmu Nakao, Takashi Takizawa, Kenichi Okada, Kazuya Masu, Tatsuya Ito. Fabrication of high-performance on-die passives based on multi-Cu-layer WLP processes, International Wafer-Level Packaging Congress, Nov. 2005.
• Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Kenichi Okada, Kazuya Masu. Integration of the passive element above IC wafers by applying Wafer Level Package technology, 3rd International Workshop on High Frequency Micromagnetic Devices and Materials, 3rd International Workshop on High Frequency Micromagnetic Devices and Materials, pp. 29-30, Apr. 2005.
• Kazuhisa Itoi, Masakazu Sato, Kenichi Okada, Kazuya Masu, Tatsuya Ito. Comparison of compact on-chip inductors embedded in Wafer-level Package, 2005 Electronic Components and Technology Conference, 2005 Electronic Components and Technology Conference, Electronic Components and Technology Conference, Vol. 2, pp. 1578-1583, 2005.
• Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Hirotaka Sugawara, Hiroyuki Ito, Kenichi Okada, Kazuya Masu, Tatsuya Ito. On-chip high-Q spiral Cu inductors embedded in wafer-level chip-scale package for silicon RF application, IEEE MTT-S International Microwave Symposium, IEEE MTT-S International Microwave Symposium, Vol. 1, pp. 197-200, June 2004.

[ BibTeX 形式で保存 ]    [ 論文・著書をCSV形式で保存 ]    [ 特許をCSV形式で保存 ]