International Conference (Reviewed)

• Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Takuya Aizawa, Oasmu Nakao, Takashi Takizawa, Kenichi Okada, Kazuya Masu, Tatsuya Ito. Fabrication of high-performance on-die passives based on multi-Cu-layer WLP processes, International Wafer-Level Packaging Congress, Nov. 2005.
• Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Kenichi Okada, Kazuya Masu. Integration of the passive element above IC wafers by applying Wafer Level Package technology, 3rd International Workshop on High Frequency Micromagnetic Devices and Materials, 3rd International Workshop on High Frequency Micromagnetic Devices and Materials, pp. 29-30, Apr. 2005.
• Kazuhisa Itoi, Masakazu Sato, Kenichi Okada, Kazuya Masu, Tatsuya Ito. Comparison of compact on-chip inductors embedded in Wafer-level Package, 2005 Electronic Components and Technology Conference, 2005 Electronic Components and Technology Conference, Electronic Components and Technology Conference, Vol. 2, pp. 1578-1583, 2005.

Domestic Conference (Not reviewed / Unknown)

• Kenichi Okada, Hirotaka Sugawara, Kazuya Masu. MEMS可変インダクタを用いたリコンフィギュラブルRF回路技術, 電子情報通信学会 電子デバイス研究会 有機エレクトロニクス研究会, Vol. 105, No. 257, pp. 45-50, Sept. 2005.
• Kazuya Masu. オンチップ伝送線路配線技術, 信学技報（集積回路研究会・電子部品・材料研究会）, 信学技報（集積回路研究会・電子部品・材料研究会）, 信学技報（集積回路研究会・電子部品・材料研究会）, CPM2005-104/ ICD2005-114, pp. 47-52, Sept. 2005.
• 杉田 英之, 伊藤 浩之, 五味 振一郎, Kenichi Okada, Kazuya Masu. Si ULSI内における擬差動伝送線路の実測による評価, 電子情報通信学会 総合大会, No. A-3-11, Mar. 2005.

Patent

• Kazuya Masu, Kenichi Okada. 差動並走線路. Patent. Registered. 国立大学法人東京工業大学. 2005/08/30. 特願2005-248547. 2007/03/15. 特開2007-067590. 特許第4820985号. 2011/09/16 2011.
• Kazuya Masu, Kenichi Okada. 伝送線路. Patent. Registered. 国立大学法人東京工業大学. 2005/08/16. 特願2005-236145. 2006/04/13. 特開2006-100797. 特許第4621917号. 2010/11/12 2010.

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