International Conference (Reviewed)

• Hiromu Onodera, Takehiko Kikuchi, Yoshitaka Oiso, Tomohiro Amemiya, Nobuhiko Nishiyama. Bonding Position Accuracy of Direct Transfer Bonding, Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration, 7th International Workshop on Low Temperature Bonding for 3D Integration, Oct. 2021.

Domestic Conference (Reviewed)

• Koki Hihara, Moataz Eissa, Keita Yamaguchi, Hiromu Onodera, Yoshitaka Ohiso, Tomohiro Amemiya, AKITOSHI OKINO, Nobuhiko Nishiyama. Investigation of Semiconductor Hydrophilicity by Atomosphere Pressure Plasma toward Heterogeneous Material-integrated Photonic Circuits, The 83rd JSAP Autumn Meeting 2022, Sept. 2022.

Domestic Conference (Not reviewed / Unknown)

• Hiromu Onodera, Takehiko Kikuchi, Yoshitaka Oiso, Tomohiro Amemiya, Nobuhiko Nishiyama. Bonding Position Accuracy of Direct Transfer Bonding, Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration, 第82回 応用物理学会秋季学術講演会, Sept. 2021.

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