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Publication List - Takehiko Kikuchi (32 entries)
Journal Paper
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Takehiko Kikuchi,
Munetaka Kurokawa,
Naoki Fujiwara,
Naoko Inoue,
Takuo Hiratani,
Toshiyuki Nitta,
Takuya Mitarai,
Yuhki Itoh,
Chang-Yong Lee,
Akira Furuya,
Yoshitaka Oiso,
Nobuhiko Nishiyama,
Hideki Yagi.
III-V gain region/Si waveguide hybrid lasers by chip-on-wafer hydrophilic bonding process using UV-ozone treatment,
Oct. 2023.
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Shaher Anis Mahmoud Eissa Moataz,
Takehiko Kikuchi,
Yoshitaka Oiso,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
High thermal performance hybrid GaInAsP/SOI ridge waveguide lasers with enhanced heat dissipation structure,
Japanese Journal of Applied Physics,
vol. 62,
no. 1,
pp. 010905,
Jan. 2023.
Official location
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Takehiko Kikuchi,
Takuo Hiratani,
Naoki Fujiwara,
Naoko Inoue,
Toshiyuki Nitta,
Moataz Eissa,
Takuya Mitarai,
Yuning Wang,
Yoshitaka Oiso,
Nobuhiko Nishiyama,
Hideki Yagi.
III–V gain region/Si waveguide hybrid lasers with InP-based two-storied ridge structure by direct bonding technology,
Japanese Journal of Applied Physics,
Vol. 61,
Number 5,
052002,
May 2022.
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Takehiko Kikuchi,
Liu Bai,
Takuya Mitarai,
Hideki Yagi,
Masato Furukawa,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer,
Japanese Journal of Applied Physics,
Vol. 59,
p. SBBD02,
May 2020.
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Takehiko Kikuchi,
Liu Bai,
Takuya Mitarai,
Hideki Yagi,
Masato Furukawa,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer,
Japanese Journal of Applied Physics,
Volume 59,
Number SB,
pp. SBBD02-1,
Dec. 2019.
International Conference (Reviewed)
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Takuo Hiratani,
Naoki Fujiwara,
Naoko Inoue,
Munetaka Kurokawa,
Takehiko Kikuchi,
Takuya Mitarai,
Toshiyuki Nitta,
Tohma Watanabe,
Hidenari Fujikata,
Nobuhiko Nishiyama,
Hideki Yagi.
SOA Integrated InP/Si Hybrid Tunable Laser by Utilizing Chip-on-Wafer Hydrophilic Bonding,
IEEE Silicon Photonics Conference,
Apr. 2024.
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Takehiko Kikuchi,
Munetaka Kurokawa,
Naoki Fujiwara,
Naoko Inoue,
Takuya Mitarai,
Hidenari Fujikata,
Takuo Hiratani,
Toshiyuki Nitta,
Yuhki Itoh,
Tohma Watanabe,
Chang-Yong Lee,
Akira Furuya,
Tsuyoshi Horikawa,
Nobuhiko Nishiyama,
Hideki Yagi.
Monolithic integration of various-type III-V epitaxial structures on silicon-photonics platform using chip-on-wafer hydrophilic bonding process,
IEEE Silicon Photonics Conference,
Apr. 2024.
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Naoko Inoue,
Takehiko Kikuchi,
Naoki Fujiwara,
Munetaka Kurokawa,
Takuo Hiratani,
Toshiyuki Nitta,
Akira Furuya,
Chang-Yong Lee,
Yuhki Itoh,
Nobuhiko Nishiyama,
Hideki Yagi.
Stable CW operation of III-V/Si hybrid lasers by chip-on-wafer direct bonding technique using UV-ozone hydrophilization,
2023 IEEE Photonics Conference,
Nov. 2023.
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Moataz Eissa,
Takehiko Kikuchi,
Yoshitaka Ohiso,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
Low-thermal-resistance by Decoupled Ridge Insulation Structure for hybrid GaInAsP/SOI ridge-waveguide lasers,
International Semiconductor Laser Conference 2022,
ISLC2022,
Oct. 2022.
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Yutaka Makihara,
Nobuhiko Nishiyama,
Takehiko Kikuchi,
Takuo Hiratani,
Naoki Fujiwara,
Naoko Inoue,
Toshiyuki Nitta,
Moataz Eissa,
Takuya Mitarai,
Yuning Wang,
Yoshitaka Oiso,
Tomohiro Amemiya,
Hideki Yagi.
Characteristics of GaInAsP/SOI Hybrid Semiconductor Optical Amplifier with InP-based Two-storied Ridge Structure,
27th Optoelectronics and Communication Conference,
July 2022.
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Takuo Hiratani,
Naoki Fujiwara,
Takehiko Kikuchi,
Naoko Inoue,
Tsutomu Ishikawa,
Toshiyuki Nitta,
Moataz Eissa,
Yoshitaka Oiso,
Nobuhiko Nishiyama,
Hideki Yagi.
III-V gain region/Si external cavity hybrid tunable lasers with InP-based two-storied ridge structure,
27th International Semiconductor Laser Conference (ISLC),
Oct. 2021.
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Hiromu Onodera,
Takehiko Kikuchi,
Yoshitaka Oiso,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
Bonding Position Accuracy of Direct Transfer Bonding, Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration,
7th International Workshop on Low Temperature Bonding for 3D Integration,
Oct. 2021.
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Takehiko Kikuchi,
Liu Bai,
Takuya Mitarai,
Hideki Yagi,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019),
May 2019.
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Takayuki Miyazaki,
Fumihito Tachibana,
Takehiko Kikuchi,
Takuo Hiratani,
Hideki Yagi,
Moataz Eissa,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Taper Length Dependence of Double-Taper-Type Coupler for GaInAsP/SOI Hybrid Integrated Platform,
Compound Semiconductor Week 2019: 31st International Conference on Indium Phosphide and Related Materials (IPRM 2019),
May 2019.
Domestic Conference (Not reviewed / Unknown)
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Takuya Okimoto,
Takuya Mitarai,
Naoki Fujiwara,
Naoko Inoue,
Takuo Hiratani,
Munetaka Kurokawa,
Takehiko Kikuchi,
Toshiyuki Nitta,
Tohma Watanabe,
Hidenari Fujikata,
Tsuyoshi Horikawa,
Nobuhiko Nishiyama,
Hideki Yagi.
エアクラッド構造を有するInP/Siハイブリッド導波路型フォトダイオード,
2024年電子情報通信学会ソサイエティ大会,
Sept. 2024.
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Takuo Hiratani,
Naoki Fujiwara,
Naoko Inoue,
Munetaka Kurokawa,
Takehiko Kikuchi,
Takuya Mitarai,
Toshiyuki Nitta,
Tohma Watanabe,
Hidenari Fujikata,
Nobuhiko Nishiyama,
Hideki Yagi.
Hybrid tunable lasers with InP-based gain region bonded on Si-slab waveguide structure,
電子情報通信学会総合大会,
Mar. 2024.
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Naoko Inoue,
Takuo Hiratani,
Naoki Fujiwara,
Takehiko Kikuchi,
Munetaka Kurokawa,
Takuya Mitarai,
Toshiyuki Nitta,
Tohma Watanabe,
Nobuhiko Nishiyama,
Hideki Yagi.
SOA integrated hybrid tunable laser by InP chip-on-SOI wafer bonding using UV-ozone hydrophilization,
第71回応用物理学会春季学術講演会,
Mar. 2024.
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Takehiko Kikuchi,
Munetaka Kurokawa,
Naoki Fujiwara,
Naoko Inoue,
Takuya Mitarai,
Hidenari Fujikata,
Takuo Hiratani,
Toshiyuki Nitta,
Yuhki Itoh,
Tohma Watanabe,
Chang-Yong Lee,
Akira Furuya,
Tsuyoshi Horikawa,
Nobuhiko Nishiyama,
Hideki Yagi.
Monolithic integration of various types of InP-based epitaxial structures on Si-photonic circuit using III-V chip-on-SOI wafer bonding,
第71回応用物理学会春季学術講演会,
Mar. 2024.
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R. Sasaki,
T. Katsuyama,
Y. Oiso,
T. Kikuchi,
Moataz Eissa,
T. Amemiya1,
N. Nishiyama.
A study of the effect of misalignment between III-V/Si waveguides in direct bonding GaInAsP/SOI optical devices,
The Institute of Electronics, Information and Communication Engineers,
Sept. 2023.
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Takehiko Kikuchi,
Munetaka Kurokawa,
Naoki Fujiwara,
Naoko Inoue,
Takuo Hiratani,
Toshiyuki Nitta,
Takuya Mitarai,
Yuhki Itoh,
Yoshitaka Oiso,
Nobuhiko Nishiyama,
Hideki Yagi.
Room-temperature CW operation of hybrid lasers by InP/SOI chip-on-wafer bonding with UV-ozone hydrophilization,
第70回応用物理学会春季学術講演会,
Mar. 2023.
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Moataz Eissa,
Takehiko Kikuchi,
Yoshitaka Ohiso,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
Low-thermal-resistance GaInAsP/SOI ridge-waveguide hybrid lasers,
2023年電子情報通信学会総合大会,
Mar. 2023.
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Ryuya Sasaki,
勝山 造,
Yoshitaka Oiso,
Takehiko Kikuchi,
エイッサ モータズ,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
直接接合GaInAsP/SOI光デバイスの活性層光閉じ込め係数制御に向けた層構造の検討,
第70回応用物理学会春季学術講演会,
Mar. 2023.
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Moataz Eissa,
Takehiko Kikuchi,
Yoshitaka Ohiso,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
Thermal resistance reduction of ridge-waveguide III-V/SOI hybrid lasers by thin ridge-insulation,
2022 IEICE Society Meeting,
2022年度電子情報通信学会ソサイエティ大会,
Sept. 2022.
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Hiromu Onodera,
Takehiko Kikuchi,
Yoshitaka Oiso,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
Bonding Position Accuracy of Direct Transfer Bonding, Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration,
第82回 応用物理学会秋季学術講演会,
Sept. 2021.
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Takehiko Kikuchi,
Takuo Hiratani,
Naoki Fujiwara,
井上 尚子,
Toshiyuki Nitta,
Shaher Anis Mahmoud Eissa Moataz,
Takuya Mitarai,
Yoshitaka Oiso,
Nobuhiko Nishiyama,
Hideki Yagi.
多段テーパ構造によるInP系利得領域/Si導波路光結合部を有するハイブリッド集積レーザの波長可変動作,
第68回応用物理学会春季講演会,
応用物理学会予稿集,
Mar. 2021.
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Takuo Hiratani,
Naoki Fujiwara,
Takehiko Kikuchi,
Toshiyuki Nitta,
Shaher Anis Mahmoud Eissa Moataz,
Yuning Wang,
Yutaka Makihara,
Nobuhiko Nishiyama,
Hideki Yagi.
Room temperature-continuous wave operation of III-V/Si hybrid lasers with two-storied ridge structure,
2020年電子情報通信学会総合大会,
Mar. 2020.
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Takehiko Kikuchi,
Naoki Fujiwara,
Takuo Hiratani,
Toshiyuki Nitta,
Moataz Eissa,
Yuning Wang,
Yutaka Makihara,
Nobuhiko Nishiyama,
Hideki Yagi.
Dependence of Si waveguide width on properties of RWG-lasers with III-V/Si direct bonding structure,
第67回応用物理学会春季学術講演会,
Feb. 2020.
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Takehiko Kikuchi,
Liu Bai,
Takuya Mitarai,
Yagi Hideki,
Toshiyuki Nitta,
Masato Furukawa,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
引張り歪層によるSi基板上InP小片接合界面の垂直応力抑制,
第80回応用物理学会秋季学術講演会,
Sept. 2019.
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Liu Bai,
Takehiko Kikuchi,
Takuya Mitarai,
Nobuhiko Nishiyama,
Hideki Yagi,
Tomohiro Amemiya,
Shigehisa Arai.
Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding,
第66回応用物理会春季学術講演会,
Mar. 2019.
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Takayuki Miyazaki,
Fumihito Tachibana,
Takehiko Kikuchi,
Takuo Hiratani,
Yagi Hideki,
Shaher Anis Mahmoud Eissa Moataz,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
SHIGEHISA ARAI.
III-V/Siハイブリッド集積プラットホーム実現に向けたハイブリッド/シリコン領域2段テーパ導波路のテーパ構造依存性,
電子情報通信学会 2018年総合大会,
Mar. 2019.
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Takehiko Kikuchi,
Junichi Suzuki,
Fumihito Tachibana,
Naoko Inoue,
Hideki Yagi,
Moataz Eissa,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
High optical coupling efficiency by double taper-type coupler structure towards III-V/Si hybrid photonic integration,
電子情報通信学会 光エレクトロニクス研究会(OPE),
IEICE technical report,
Vol. 118,
No. 348,
pp. 161-164,
Dec. 2018.
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Liu Bai,
Takehiko Kikuchi,
Takuya Mitarai,
Nobuhiko Nishiyama,
Hideki Yagi,
Tomohiro Amemiya,
Shigehisa Arai.
Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits,
電子情報通信学会 光エレクトロニクス研究会(OPE),
IEICE technical report,
Vol. 118,
No. 348,
pp. 149-153,
Dec. 2018.
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