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Publication List - Yuning Wang (15 entries)
Journal Paper
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Takehiko Kikuchi,
Takuo Hiratani,
Naoki Fujiwara,
Naoko Inoue,
Toshiyuki Nitta,
Moataz Eissa,
Takuya Mitarai,
Yuning Wang,
Yoshitaka Oiso,
Nobuhiko Nishiyama,
Hideki Yagi.
III–V gain region/Si waveguide hybrid lasers with InP-based two-storied ridge structure by direct bonding technology,
Japanese Journal of Applied Physics,
Vol. 61,
Number 5,
052002,
May 2022.
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Yuning Wang,
Kumi Nagasaka,
Takuya Mitarai,
Yoshitaka Oiso,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
High-quality InP/SOI heterogeneous material integration by room temperature surface-activated bonding for hybrid photonic devices,
Japanese Journal of Applied Physics,
Japanese Applied Physics Society,
Vol. 59,
No. 5,
p. 052004,
Apr. 2020.
Official location
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hibiki kagami,
tomohiro amemiya,
Makoto Tanaka,
Yuning Wang,
Nobuhiko nishiyama,
Shigehisa Arai.
Metamaterial infrared refractometer for determining broadband complex refractive index,
Optics Express,
Vol. 27,
No. 20,
pp. 28879-28890,
Sept. 2019.
International Conference (Reviewed)
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Yutaka Makihara,
Nobuhiko Nishiyama,
Takehiko Kikuchi,
Takuo Hiratani,
Naoki Fujiwara,
Naoko Inoue,
Toshiyuki Nitta,
Moataz Eissa,
Takuya Mitarai,
Yuning Wang,
Yoshitaka Oiso,
Tomohiro Amemiya,
Hideki Yagi.
Characteristics of GaInAsP/SOI Hybrid Semiconductor Optical Amplifier with InP-based Two-storied Ridge Structure,
27th Optoelectronics and Communication Conference,
July 2022.
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weicheng Fang,
Yuning Wang,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
InP/SiO2/Si Surface Activated Bonding assisted by Si nano-film,
9th International Symposium on Photonics and Electronics Convergence,
Nov. 2019.
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Yuning Wang,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Investigation of InP/Si bonding condition for optimizing Photoluminescence property by Surface Activated Bonding based on Fast Atom Beam,
Compound Semiconductor Week 2019: 31st International Conference on Indium Phosphide and Related Materials (IPRM 2019),
May 2019.
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Yuning Wang,
Kumi Nagasaka,
Junichi Suzuki,
Liu Bai,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Photoluminescence properties of GaInAs/InP layers by Ar fast atom beam for room temperature surface activated bonding toward hybrid PIC,
Compound Semiconductor Week 2018,
May 2018.
Domestic Conference (Not reviewed / Unknown)
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Takuo Hiratani,
Naoki Fujiwara,
Takehiko Kikuchi,
Toshiyuki Nitta,
Shaher Anis Mahmoud Eissa Moataz,
Yuning Wang,
Yutaka Makihara,
Nobuhiko Nishiyama,
Hideki Yagi.
Room temperature-continuous wave operation of III-V/Si hybrid lasers with two-storied ridge structure,
2020年電子情報通信学会総合大会,
Mar. 2020.
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Takehiko Kikuchi,
Naoki Fujiwara,
Takuo Hiratani,
Toshiyuki Nitta,
Moataz Eissa,
Yuning Wang,
Yutaka Makihara,
Nobuhiko Nishiyama,
Hideki Yagi.
Dependence of Si waveguide width on properties of RWG-lasers with III-V/Si direct bonding structure,
第67回応用物理学会春季学術講演会,
Feb. 2020.
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Weicheng Fang,
Yuning Wang,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
Investigation of bonding strength between (InP, Si)/SiO2 and Si by Surface Activated Bonding based on Fast Atom Beam assisted by Si nano-film,
第80回応用物理学会秋季学術講演会,
Sept. 2019.
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Yuning Wang,
Moataz Eissa,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
Investigation of Photoluminescence property of InP/SOI wafer after bonding experiment using Surface Activated Bonding based on Fast Atom Beam,
第80回応用物理学会秋季学術講演会,
Sept. 2019.
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Yuning Wang,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Investigation of InP/Si bonding condition for suppressing degradation of Photoluminescence property using Surface Activated Bonding,
第66回応用物理会春季学術講演会,
Mar. 2019.
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Takuya Mitarai,
Shaher Anis Mahmoud Eissa Moataz,
Takayuki Miyazaki,
Fumihito Tachibana,
Liu Bai,
Yuning Wang,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
SHIGEHISA ARAI.
Si曲げ導波路による方向性光結合器を用いた広帯域ループミラーの作製,
電子情報通信学会 光エレクトロニクス研究会,
Dec. 2018.
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Yuning Wang,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Gas Species Comparison of Fast Atom Beam Irradiation to Photoluminescence Properties of GaInAs/InP layers for Surface Activated Bonding,
The 79th JSAP Autumn Meeting,2018,
Extended abstracts of the 79th JSAP autumn meeting,
The Japan Society of Applied Physics,
Sept. 2018.
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Kumi Nagasaka,
Junichi Suzuki,
Takuya Mitarai,
Yuning Wang,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Investigation of InP/Si bonding characteristics of Ar-FAB surface activated bonding for hybrid integration,
The 65th JSAP Spring Meeting, 2018,
Mar. 2018.
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